The DDR5 memory module is supports transfer rate of 4.8 to 5.6Gbit/s, 1.8 times faster than the previous generation, at 1.1V rather than 1.2V. This reduces the power consumption by 20 percent, which is key for data centre applications, and integrates the power management IC (PMIC) into the module for the first time.
The company has supplied samples of the 16Gbit DDR5 memory to major partners including Intel, and has completed various tests and verification of its functions and compatibility. 3D sacking of die using through-silicon-via (TSV) interconnect enables a capacity of 256Gigabytes in a single package.
SK Hynix has also been working with System-on-Chip (SoC) manufacturers such as Renesas to verify the functions of DDR5, including the register clock driver (RCD) in the module that ensures signal quality between the transmitter and the receiver by amplifying commands and data signals applied to memory from memory controllers. It has also been testing the PMIC in the module.
The Error Correcting Code (ECC) inside the chip that can correct even 1-bit-level errors by itself. With the ECC, the reliability of applications will be increased by 20 times.
"Intel partnered closely with memory leaders including SK hynix on the DDR5 spec development starting with early architecture concepts through JEDEC standardization," said Carolyn Duran, Vice President of Intel's Data Platforms Group and GM of Memory and IO Technologies. "In addition, we worked collaboratively with SK hynix on silicon development by designing and testing prototypes to ensure DDR5 meets its performance goals and are fully ready for our mutual customers."
"As SK hynix has launched World's First DDR5 DRAM, the Company could lead the future technology trend in global DRAM market," said Jonghoon Oh, Executive Vice President and Chief Marketing Officer (CMO) at SK hynix. "SK hynix will focus on the fast-growing premium server market, solidifying its position as a leading company in server DRAM."
The DDR5 standard was published by JEDEC (JEDEC Solid