Two pin D²PAK packaging for SiC diodes

March 26, 2020 //By Nick Flaherty
SiC diodes in a two pin surface mount package from Infineon increase safety margins and simplify power designs
SiC diodes in a two pin surface mount package from Infineon increase safety margins and simplify power designs

Infineon Technologies has added a D²PAK surface mount two pin package option to its range of 1200V silicon carbide SiC Schottky diodes.

Six devices in the CoolSiC Schottky diode 1200 V family use the two pin SMD packages for more compact and more cost effective designs in industrial power supplies, and DC charging stations, uninterruptable power supplies, and solar string inverters. Eliminating the middle pin increases the creepage to 4.7 mm and the clearance distance to 4.4mm which compared to a standard D²PAK package enhances safety margins.

The SiC devices use Infineon’s CoolSiC 1200 V G5 technology that prevents reverse recovery losses and allows for temperature-independent switching behaviour. This can streamline designs with lower cooling requirements and smaller magnetics when used at higher switching frequency. Using diodes in the D²PAK two pin package allows designers to reach higher power densities than siliocn designs and combined with the 1200V CoolSiC MOSFETs or TRENCHSTOP 1200 V IGBT6 and EiceDRIVER gate driver chips can provide higher conversion efficiencies.

The CoolSiC Schottky diodes 1200 V G5 are rated from 2 A to 20 A. and can be ordered now.

www.infineon.com/sicdiodes1200v

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