Thermoelectric assembly boosts cooling by 60 percent 

August 02, 2018 //By Nick Flaherty
Thermoelectric assembly boosts cooling by 60 percent 
 Laird has developed a new heatsink design that boosts the cooling performance per unit volume of its high performance thermoelectric assembly (TEA) by 60 percent.

The SuperCool Series TEA is designed for precise temperature control refrigeration applications in medical diagnostics and analytical instrumentation. The hot side air heat sink design dissipates heat more efficiently than competing heat exchanger technologies and combined with a heat sink and fan shroud assembly, transfers heat to air more rapidly.

"This is a major breakthrough for thermoelectric assembly technology to offer such high heat pumping capacity in a small form factor. The SuperCool Series enhances the cooling performance by up to 60% in same form factor versus conventional thermoelectric assemblies," said Anders Kottenauer, Senior Vice President of Laird's Thermal Systems business. "Our customers in the medical and analytical markets are demanding more stringent thermal requirements with less available space to work with. We have extensive design expertise, a diverse product portfolio, and a global footprint, which matches up well for our customers’ requirements."

The SuperCool Series contains three models to provide engineers with heat transfer mechanism options on the control side. Heat can be absorbed via liquid, conduction or convection. The Liquid to Air unit has a cooling capacity of 202W, while the Direct to Air has 193 Watts and the Air to Air has 166W. All cooling capacities were measured at ΔT=0°C with a nominal operating voltage of 24 VDC. Custom configurations are available upon request.

www.lairdtech.com/supercool
 


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