TE shows power connector tech for data centres

March 15, 2019 //By Nick Flaherty
TE shows power connector tech for data centres
TE Connectivity has been demonstrating its power connector technologies for data centres at the Open Compute Project (OCP) summit in California this week.

TE's power connectors, cable assemblies and bus bars provide customisable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can deliver operational and overall system cost savings with low energy consumption and remain compatible with specifications for use in rack-level bus bar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.  

The high performance board-to-board products address the needs for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects. The memory interconnects are manufactured to JEDEC industry standards for dual in-line memory modules (DIMM). These connectors can provide end latches for module retention and ejection as well as mechanical voltage keying.

"TE has supported the OCP community for years, and we are the go-to source for high-performance power and data connectivity solutions," said Eric Himelright, vice-president for data and devices, product management at TE Connectivity.  "Our broad engineering expertise and constant drive to innovate mean that our solutions deliver on the speed, density, and high efficiency requirements of OCP designers." 

www.te.com

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