The MEGACAP CA series has capacitor stacks side-by-side to provide rated voltages from 25 V to 1000 V from 20 nF to 150 µF with C0G, X7T, X7S, and X7R temperature characteristics. The high capacitance values means the capacitors are suitable for the resonant circuits of wireless and plug-in charging systems, for example, for industrial vehicles and robots. They can also be used in smoothing and decoupling applications in industrial equipment.
Production of the CA series began in April 2018. Automotive grade products will be introduced after mid-2018.
The MEGACAP Type MLCCs have metal lead frames attached to the electrode ends of the components to protect against board flexure cracks and solder cracks from thermal shocks. The metal material of the terminal has also been optimized to lower the ESR and achieve a higher ripple current capability.
To reduce the profile, TDK has adapted its MEGACAP stack design so that the MLCC elements are stacked side by side, which allows stacks with three or even more elements. Hybrid joints between the metal terminals and the MLCC are both soldered and clamped to prevent the individual MLCC elements from falling out of the lead frame at the increasingly higher reflow temperatures.
The CA series will be available initially with 2x and 3x stacks. In the future the lineup will be expanded with 5x stacks.
|Type||Temperature characteristic||Rated voltage [V]||Capacitance [F]||Stacked elements||Dimensions [mm]|
|CAA572C0G3A203J||C0G||1000||20n||2||2x stack:6.1 x 5.6 x 6.4 |
3x stack:6.1 x 8.4 x 6.4
|CAA572X7T2J105M||X7T||630||1μ||2||2x stack:6.1 x 5.0 x 6.4 |
3x stack:6.1 x 7.5 x 6.4
|CAA572X7R1V107M||X7R||35||100μ||2||2x stack:6.4 x 5.0 x 6.8 |
3x stack:6.4 x 7.5 x