The latest release of XFdtd 3D EM simulation software, says the company, enables engineers to identify potential locations of dielectric breakdown and components at risk of damage in their device designs. It enables optimized ESD mitigation during the concept and design stage, ultimately reducing development costs and preventing post-sale product failures.
"ESD requires the testing of many hardware prototypes and can contribute to a high number of warranty claims and lost revenue," says Greg Moss, XFdtd research manager at Remcom. "The new ESD simulation functionality has a direct positive impact on manufacturers' profitability by decreasing their time to market, improving the reliability of their products, and strengthening consumer confidence."
The software features a new dielectric strength material property that allows users to input the maximum electric field a material can withstand before losing its insulating properties. Users may then add a dielectric breakdown sensor to monitor a selected area for electric fields that exceed the specified maximum during transient simulations.
In addition to pinpointing these compromised areas, XFdtd also monitors specific electronic components that are taxed beyond their rated voltage and current input parameters during ESD testing. Post simulation results identify those components that are subject to permanent damage due to unsafe limits.