The dimensioning and electrical design of the power electronic modules was carried out in direct cooperation with automobile manufacturers, component suppliers and component manufacturers. This makes it possible to make optimum use of space in the vehicle drive train. Lars Böttcher is group leader at Fraunhofer IZM and sub-project leader for the SiC project. He explains: "We are going beyond general feasibility, because in this project we are developing more than just a prototype. The goal is to get both the new semiconductor material silicon carbide and the embedding technology on the way to series production.
The project is funded by the Federal Ministry of Education and Research as part of the E-Mobility Call with a project volume of 3.89 million euros and runs until December 2020. In addition to Fraunhofer IZM, six other partners are involved in the project: AixControl - Gesellschaft für leistungselektronische Systemlösungen mbH, Conti Temic microelectronic GmbH, Rheinisch-Westfälische Technische Hochschule Aachen, Robert Bosch GmbH, Schweizer Electronic AG and TLK-Thermo GmbH.
More Information: https://www.izm.fraunhofer.de/en.html