The LBAD0ZZ1RX measures just 15.6 mm x 14.0 mm x 2.2 mm, is fabricated on a PCB with a DC-DC converter and a power management IC to drive a HiSilicon Hi2115 single-die wireless SoC device that provides the radio transceiver, baseband and application processor functions. The power optimisation allows a battery life of up to ten years for designs in the Internet of Things (IoT).
The module also includes thewireless front end matching components such as baluns and low pass filters and an RF switch. The HiSilicon Hi2115 includes an Arm Cortex M0 processor core running at 40 MHz and equipped with 64 kBytes of SRAM and 256 kBytes of Flash that controls module communications using the industrial standard AT command set. The module features a comprehensive set of peripheral interface functions including UART, I²C and SPI along with GPIO and an ADC.
The module conforms to the NB-IoT 3GPP release 13 narrow-band standard and can operate in the low and middle bands and mass production is scheduled for Q1 2019.
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