Peltier cooling modules have unique construction for longer life

April 05, 2017 //By Nick Flaherty
CUI arcTEC Peltier effect
CUI’s Thermal Management Group has launched a line of high performance Peltier cooling modules that have a longer life by using a structure called arcTEC.

This uses a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from a premium silicon ingot. The elasticity of the arcTEC resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, which reduces stress on the elements, resulting in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time. High temperature solder and larger silicon elements are incorporated to enable faster and more uniform cooling.

The CP20H, CP30H, CP39H, CP60H, and CP85H series all employ the arcTEC structure and range in size from 15 mm to 40 mm, with profiles as low as 3.1 mm. These thermoelectric modules are available with a ∆Tmax of 77°C (Th=50°C) and current ratings ranging from 2.0 A to 8.5 A. 

The solid state construction, precise temperature control and quiet operationmeans the thermoelectric coolers are aimed at high density, high power medical and industrial applications as well as refrigeration and sealed environments where forced air cooling is not an option.

The CP20H, CP30H, CP39H, CP60H, and CP85H series are available immediately with prices starting at $15.53 per unit at 25 pieces through distribution.

Please contact CUI for OEM pricing at

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