The HP35ULB700 process eliminates five photolithography steps through process simplification compared with the previous generation of UHV technology, making it possible to reduce manufacturing cost and time to market.
Among the devices offered in HP35ULB700 are 700V low Ron nLDMOS, 500V nLDMOS, 700V JFET, 5.5V CMOS, BJT, 700V resistor, BP cap, and MIM and fuse. All these devices enable the integrated solution of AC-DC converter ICs and LED driver ICs. The 700V low Ron nLDMOS devices offer improved specific-on-resistance of 150 mohm·cm2. In addition, the devices enable various design schemes, including the possibility to separate or connect the source and the bulk in nLDMOS.
The demand for AC-powered products in home appliances continues to increase, creating the need for highly efficient and cost-competitive AC-DC converter ICs, AC-DC chargers and LED driver ICs, and the simplified 700V UHV process technology is suited to these power-related products.
"Our 0.35 micron 700V UHV technology provides our foundry customers with a high-performance, highly efficient manufacturing process for AC-DC converter ICs and LED driver ICs for various LED lighting applications," said YJ Kim, MagnaChip's Chief Executive Officer. "To meet the diverse customer requirements, MagnaChip will continue to develop new UHV technologies such as customer-specific UHV processes with additional option devices." The company operates three fabs in South Korea at Cheongju and Gumi with power and OLED process technologies from 0.11 to 0.50 microns.