Low profile cooling plate for power electronics

August 02, 2021 // By Nick Flaherty
Low profile cooling plate for power electronics
Mersen’s IsoMAXX cold plates have been specially developed for the latest SiC, GaN or IGBT power modules.

Mersen has developed a cooling plate for power electronics with high thermal capacity and minimal pressure drop.

The IsoMAXX cold plates have been specially developed for the latest SiC, GaN or IGBT power modules.Modern converters, transport systems, electric vehicles and alternative energy generators benefit from the increasingly efficient wide bandgap electronics, which are optimised for operation at higher switching frequencies and temperatures and feature a much more compact design. Conventional heat sinks cannot meet these high cooling requirements.

IsoMAXX uses a vacuum brazed cold plate to provide an average thermal resistance (Rth) of 6 °C/kW. At ~600 mbar, the pressure drop is substantially lower than that of all previous models.

The cold plates ensure an optimal temperature range for chip-to-chip (all chips at the same T°) and module-to-module on a multi-module cooling plate. This helps development engineers increase efficiency and reduce the footprint as there is no minimum clearance is required between modules.

This allows versatile integration regardless of the number of modules needed for a particular application.

ep-de.mersen.com

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