Liquid alloy hybrid boosts thermal dissipation

March 15, 2019 //By Julien Happich
Liquid alloy hybrid boosts thermal dissipation
Indium has developed a solid/liquid hybrid thermal interface material designed to provide ultra-reliable dissipation of heat.

m2TIM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity. The new hybrid interface materials come in a variety of alloys, including InGa and InGaSn, with extraordinary wetting ability to both metallic and non-metallic surfaces and extremely low interfacial resistance. They eliminate the risk of pump-out of the liquid alloy due to absorption by solid solder preforms

Indium Corporation - www.indium.com


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