Interconnect boosts MLCC ceramic capacitor capacity

June 03, 2020 //By Nick Flaherty
Kemet's KC-Link MLCC is using the Konnekt sintered interconnect in high power designs that need a small form factor
Kemet's KC-Link MLCC is using the Konnekt sintered interconnect in high power designs that need a small form factor

Kemet has extended its multi-layer ceramic capacitor MLCC range using a new high-density packaging technology to boost the capacitance. This is aimed at designs with wide bandgap (WBG) semiconductors in electric vehicle, LLC resonant converters and wireless charging applications.

The KC-LINK MLCC range combines the Kemet's proprietary C0G Base Metal Electrode (BME) dielectric system with its Konnekt Transient Liquid Phase Sintering (TLPS) material. This creates a surface mount multi-chip package. This provides four times the capacitance compared to a single multi-layer ceramic capacitor.

The high mechanical robustness allows the KC-LINK capacitors to be mounted without the use of lead frames. This reduces the effective series inductance (ESL), increases the operating frequency range and allowing for further miniaturization. The MLCC range is available in commercial grade with tin termination finish that is Pb-Free, RoHS and REACH compliant. Capacitors using the KONNEKT technology can be mounted in a low-loss orientation to increase their power handling capability further

The combination of the Class 1 C0G dielectric system with the Konnekt technology provides a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. This is particularly important for DC-DC converter designs in aerospace, medical and automotive applications. 

“The low ESR of KC-LINK capacitors results in best-in-class ripple current capability,” said Dr. John Bultitude, vice president and Technical Fellow at Kemet. “Combined with Konnekt technology, this delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”

The KC-LINK range with Konnekt technology is available immediately.

kemet.com/konnekt

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