Based on the new micro-pattern trench technology, the TRENCHSTOP IGBT7 chip performs with much lower static losses compared to the IGBT4 through an on-state voltage reduced by 20 percent. This brings significant loss reduction in the application, especially for industrial drives, which usually operate at moderate switching frequencies. The power modules feature a maximum allowed overload junction temperature of 175°C and have softer switching and an improved controllability.
The 1200 V TRENCHSTOP IGBT7 modules are designed with the same pin out as the IGBT4 modules, which supports manufacturers in reducing their design efforts. More importantly, the new modules enable a higher output current in the same package, or the similar output current in a smaller package. As a result, designers can realize more compact inverter designs where needed. All module types are equipped with Infineon’s reliable PressFit mounting technology for low ohmic resistance and reduced process time.
The TRENCHSTOP IGBT7 technology is offered in an industry-standard EasyPIM housing for the current classes 10 A and 25 A. For more power, the EasyPACK 2B carries 100 A. Lead types are FP10R12W1T7_B11, FP25R12W1T7_B11 and FS100R12W2T7_B11.