First 300mm CMOS diamond wafer

July 27, 2021 // By Nick Flaherty
First 300mm CMOS diamond wafer
A 300mm CMOS diamond wafer developed by Akhan Semiconductor in Illinois fits into existing processes and enables higher thermal performance

Akhan Semiconductor in the US has developed the first 300mm (12in) wafter that combines CMOS silicon with a diamond substrate. The substrate gives more advantages for power handling, heat management and durability of electronics across industries with little change to fabricators’ existing manufacturing processes.

The company makes synthetic, lab-grown electronics-grade diamond materials for semiconductor, telecom, and consumer industries and global markets.

“The semiconductor chip shortage has been well documented this year,” said Tom Lacey, Akhan’s Chairman of the Board. “As the U.S. plans to increase chip supply, it is also important to fabricate using the best materials available to enable the best performance.”

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“Akhan’s 300mm diamond wafer is the foundational building block that will lead to more powerful and durable devices that run cooler, and fabricators only need to make minor updates to their existing manufacturing processes,” said Adam Khan, Founder of Akhan Semiconductor. “From weapon systems to spacecraft, the world’s most sophisticated devices and technologies stand to benefit exponentially from diamond. Now that we’ve proven the ability to manufacture this ideal material on 300mm wafers, fabricators will have access to the most optimal chip material so that their end products perform far more efficiently.”

The company also flags its position as a local US supplier that is not vulnerable to issues in the CMOS wafer supply chain where the vast majority ar produced in Asia.

“As the United States assesses the semiconductor supply chain in light of the current global shortage and works to recapture its leadership position within this critical space, policymakers must prioritize the companies that are moving beyond silicon by innovating and developing next generation chips with materials like diamond,” said the company. “Beyond diamond’s advanced capabilities, US adversaries understand how powerful this coveted jewel can be and are prioritizing the development of the material for advanced weapons usage.”

www.akhansemi.com

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