The AONP36336 is an extension to the XSPairFET lineup which is designed with the latest bottom source packaging technology. The AONP36336 has lower switch node ringing due to lower parasitic inductance and has an integrated high-side and low-side MOSFETs (4.7mOhms and 5.8mOhms maximum on-resistance, respectively) within the XSPairFET package. The low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. Using an existing notebook design under conditions, 15V input voltage, with 8.4V output voltage, and a 6A output load condition operating at 1MHz, the AONP36336 can achieve 97 percent efficiency.
“Type-C has a wide market acceptance and with the significant performance improvement, the AONP36336 is ideal for buck-boost in Type-C applications,” said Peter Wilson, Marketing Director of MOSFET product line at AOS.
The AONP36336 is immediately available in production quantities with a lead-time of 16 weeks. The unit price for 1,000 pieces is $0.60.