Die sized packaging reduces DC-DC converter footprint in battery design

October 02, 2019 //By Nick Flaherty
TI's TPS63802, TPS63805, TPS63806 and TPS63810 buck-boost DC-DC converter devices are packaged in a 15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA).
TI's TPS63802, TPS63805, TPS63806 and TPS63810 buck-boost DC-DC converter devices offer wide input and output voltage ranges that scale to support multiple battery-driven applications in a 15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA).

Texas Instruments (TI) has launched a buck-boost DC-DC converter family with wafer scale packaging to minimise the board space.

The noninverting TPS63802, TPS63805, TPS63806 and TPS63810 buck-boost DC-DC converter devices offer wide input and output voltage ranges that scale to support multiple battery-driven applications in a 15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA).

Each of the devices in the family automatically selects buck, buck-boost or boost mode according to the operating conditions. Their complete solution size of 19.5 mm 2 to 25 mm 2 – up to 25% smaller than similar devices – is a result of compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors, and 0.47µH inductors. The devices have a 1.3-V to 5.5-V input range and 1.8-V to 5.2-V output voltage range with an output up to 2.5A, which helps engineers speed their designs and encourages reuse across multiple applications.

The DC-DC converter family has a low quiescent current (IQ) of 11 to 15µA for light-load efficiency while minimizing power losses and extending run times in battery-driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.

The TPS63802 is a 2-A buck-boost converter with low 11-µA IQ consumption suitable for pulsed-load applications such as industrial Internet of Things devices.

The TPS63805 is a 2-A buck-boost converter with a 22-µF output capacitor and 0.47-µH inductor resulting in a small solution size of 19.5 mm2 that meets the requirements of handheld industrial and personal electronics applications.

The TPS63806 is a 2.5-A buck-boost converter with a focus on improved load-step regulation for applications with an aggressive load profile that require tight regulation, such as time-of-flight sensors in smartphones, cameras or augmented reality devices.

The TPS63810 is a 2.5-A buck-boost converter with I2C interface for dynamic voltage scaling through either a two-wire interface or the VSEL pin, enabling the device to serve as a pre-regulator or voltage envelope tracker for systems found in smartphones, wireless hearing aids or headphones.

The TPS63805 and TPS63806 devices are


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