Dialog’s partitioning into system and sub-PMIC devices offers the advantages of scalability and flexibility while distributing the power dissipation in adverse temperature environments. The power management chipset comprises the DA9063-A system PMIC and two sub PMICS, the DA9213-A and DA9214-A and different combinations of system and sub-PMICs are used depending on the end application.
Dialog is currently one of the preferred power solution providers in Renesas’ second-generation R-Car H2 platform but Renesas now also has a power chipset supplier in-house in the form of Intersil for the next generation designs.
“We have a track record of innovation in developing differentiated energy-saving power management solutions,” said Paul Wheeler, Vice President Mobile Systems at Dialog Semiconductor. “These solutions are critical for leading technology partners such as Renesas to stay ahead of the competition, as the continued convergence of mobile technologies like smartphones, tablets, and wearables with vehicles, drives the increase in processing requirements for infotainment, navigation and always-on connectivity applications.”
The ability of Dialog’s PMICs to distribute power dissipation in adverse temperature environments is a key benefit to module makers. As the available area behind the infotainment module’s LCD screen becomes increasingly constrained, heat dissipation has become a critical factor when adding functionality.
“With the newest generation of cars hitting the roads, demands for next-generation infotainment systems, connected car platforms and autonomous driving are on the rise,” said Masayasu Yoshida, Senior Director of 1st Solution Business Unit at Renesas Electronics. “The combination of the R-Car H3 SoC and Dialog's power solutions improves power efficiency on automotive information systems, and provides flexibility for our end-customers to easily make configuration and sequencing changes to match their individual needs.”
Dialog’s platform delivers 14 percent lower power dissipation when compared to competing PMICs. That reduction combined with the multi-rail support, in-system reprogrammable power sequencing offered via the SmartCanvas GUI, dynamic voltage scaling, and over-temp and over-voltage shut down, allows optimum flexibility in a market leading power solution.
For more information see www.dialog-semiconductor.com/power-solutions-renesas-processors.