Denso launches semiconductor venture with Toyota

July 10, 2019 //By Christoph Hammerschmidt
Denso launches semiconductor JV with Toyota
Tier One car system maker Denso is teaming up further with Toyota on a joint venture to develop semiconductors, including power devices, for use in future vehicle generations.

Recently, electronic controls have been increasingly implemented into vehicles. Furthermore, the number of in-vehicle semiconductors has also grown, and the performance of these semiconductors has continuously improved. To create a future of mobility that is safe and sustainable, it is necessary to develop next-generation semiconductors that are integral to technology innovations, such as connected cars, automated driving, sharing mobility and electrification.

In June 2018, Denso and Toyota agreed to consolidate the electronic components production and development functions to Denso. Based on this agreement, they have been working to achieve a speedy and competitive production and development system.

Denso has decided to establish the new company for research and advanced development of in-vehicle semiconductors. The company also agreed to accept equity participation from Toyota for the new company to accelerate the speed of development by taking advantage of Toyota’s knowledge from a mobility viewpoint. Through equity participation in the new company, Toyota hopes to achieve further technology innovations by introducing cutting-edge semiconductor technologies from the planning phase when developing its mobility services and vehicles.

The new company will conduct advanced research on the basic structure and processing method of next-generation semiconductors and develop electronic components by implementing semiconductors, such as power modules for electric vehicles and periphery monitoring sensors for automated vehicles, thereby contributing to creating the future of mobility.

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