Allegro MicroSystems has developed a custom 16pin SOIC16W package for current sensing capabilities for power dense applications that require high isolation with low power loss.
The MC package has an ultra-low (265 microhm) series resistance, 2.5 times lower than existing SOIC16W solutions, while maintaining a certified isolation rating of 5kVRMS.
This capability comes from a copper leadframe more than two times (2X) thicker than that of standard SOIC semiconductor packages. This allows for the ultra-low 265 microhm series resistance that improves current density in the Allegro package and higher power density in applications. At the same time, the SOIC16W footprint also allows for smaller PCBs. The SOIC package is capable of handling over 80A of continuous current depending on operating temperature requirements and subsequently reduces the need for external cooling components.
A patented internal package construction allows the 5kVRMS isolation rating so that designs can run at continuous voltages as high as 1600VDC and 1140VRMS. This meets the needs of the most demanding electric vehicle applications and the new 1500VDC solar standards.
The first devices available in this new package are Allegro’s ACS724 and ACS725 current sensors. These are aimed at applications such as DC-DC converters, solar inverters, UPS systems, xEV On Board Chargers (OBC), EV charging pile, and motor control.
“We all need to work toward a more sustainable future and Allegro’s innovations are leading the way. Designers of electric and hybrid vehicles are working to reduce the weight and size of their systems,” explains Shaun Milano, Business Unit Director for Current Sensors at Allegro. “They need to deliver higher power density solutions, and the new MC package now makes this easier than ever.”