Ceramic capacitors in modular flex-assembly technology

November 14, 2018 //By Nick Flaherty
Ceramic capacitors in modular flex-assembly technology
TDK has extended its range of ceramic capacitors for high power designs in modular flex-assembly technology.

The CeraLink FA modules connect two, three or ten identical capacitors in parallel over the same terminals in order to increase the capacitance. The capacitors are available for rated DC voltages of 500V, 700V and 900V and depending on the voltage and number of capacitors, this results in rated capacitance values of between 0.5 µF and 10 µF.

One particular feature of these capacitors based on PLZT (lead lanthanum zirconate titanate) ceramics is their high permissible operating temperature of 150 °C. The FA types have a width of 7.4 mm and a height of 9.1 mm; while the lengths are 6.3 mm, 9.3 mm or 30.3 mm. Despite their small size, they feature a ripple current capability of up to 47 ARMS.

One major advantage of the parallel switching is the extremely low ESR values that are significantly below 10 mΩ at high frequencies in the range from 0.1 to 1 MHz. With a minimum of 3 nH, the ESL values are also extremely low. Thanks to their low parasitic effects, CeraLink capacitors are ideally suited for converter topologies on the basis of fast-switching semiconductors such as GaN or SiC. Voltage overshoots when switching are significantly lower than with conventional capacitor technologies. Special requirements in terms of size, current capability and temperature can also be met.

The capacitors are aimed at applications such as DC link or snubber capacitors in fast-switching converters and are suitable for converter topologies based on fast-switching semiconductors such as GaN or SiC.

www.tdk-electronics.tdk.com/ceralink

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