The smaller form factor of 3.3mm x 3.3mm enables higher power density designs in gate-driving power MOSFETs and IGBTs, linear DC-DC step-down regulators, PNP LDOs, and load switch circuits.
Targeted at both industrial and consumer markets, the DXTN07xxxxFG (NPN) and DXTP07xxxxFG (PNP) series range from 25V to 100V VCEO; they also feature total power dissipation of 2W and are rated up to +175°C operation. The transistors are housed in the compact PowerDI®3333 surface mount package measuring just 3.3mm x 3.3mm x 0.8mm, occupying 70% less PCB space than the traditional SOT223, while delivering similar power dissipation in a more thermally efficient package.
The PowerDI3333 package increases PCB throughput by featuring wettable flanks, which help with the high-speed, automatic optical inspection (AOI) of solder joints and so eliminate the need for X-ray inspection.
The full range of DXTN07xxxxFG and DXTP07xxxxFG devices, launched at Embedded World this week, are sampling commercially with automotive qualification to be completed by end of Q1 2019. They are priced at $0.19 each in 5000 piece quantities.