Infineon Technologies Bipolar has expanded its range of thyristor diode modules with a 60mm, 600 A pressure contact version.
The new Prime Block 50 mm bipolar thyristor modules feature solder bond technology and the 60 mm modules uses pressure contact technology. They are designed for applications with a current over 600 A for the 60 mm footprint or 330 A for a 50 mm footprint. This avoids the paralleling of modules when this is not an option in designs such as industrial AC and DC drives as well as for rectifiers and bypasses in UPS.
The modules have been optimized for better thermal resistance and higher operational temperatures than current designs, increasing the power density. The pressure contact modules in general provide best-in-class blocking stability, while the solder bond modules fully undergo an X-ray monitoring after the soldering process.
The variant in the 60 mm standard housing comes in the topologies thyristor/thyristor and thyristor/diode with a blocking voltage of either 1600 V or 2200 V and in current ratings from 700 A to 820 A. The 50 mm standard housing variant is offered in the topologies thyristor/thyristor, thyristor/diode and diode/diode. Its blocking voltage stands at 1600 V, 1800 V and 2200 V, the modules supports current ratings of up to 390 A.
The 50 and 60 mm Prime Block family is available now in volume. The next portfolio extension will support customers with pre-applied Thermal Interface Material (TIM). This not only keeps production lines fast and clean, additionally it further improves thermal behaviour.