Texas Instruments (TI) has launched a 36V, 4A 100W DC-DC converter buck module in a quad flat no-lead (QFN) package.
The TPSM53604 DC-DC converter measures 5 x 5.5mm to shrink the size of a power supply by 30 percent to 85 mm 2 while reducing power loss by half compared to similar modules. A single thermal pad optimises heat transfer to simplify mounting on a single sided board, which enables the DC-DC converter to operate in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defence.
Pairing the TPSM53604 with a step-down module such as the TPSM82813 and TPSM82810 enables a complete power design from a 24V input down to the point of load.
The QFN package allows 42 percent of the footprint to touch the board, enabling more efficient heat transfer compared to competing ball-grid-array (BGA) packages. In addition, the module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90 percent at 24 V to 5 V.
Integrated high-frequency bypass capacitors and lack of bond wires help the DC-DC converter meet the electromagnetic interference (EMI) standard defined by CISPR 11 Class B limits.
The TPSM53604 is now available from TI and authorized distributors. Pricing starts at US$3.65 in 1,000-unit quantities. A TPSM53604 evaluation module is available on TI.com for US$49.
Production quantities of a 2A version, the TPSM53602, and a 3A version, the TPSM53603 are also available with pricing starting at US$2.64 and US$3.21 in 1,000-unit quantities.