Thermal solver simulates designs from the die to the enclosure

New Products |
By Nick Flaherty

Cadence Design Systems has launched a electrical-thermal co-simulation tool for the full hierarchy of electronic systems from die to physical enclosures.

The Celsius Thermal Solver, which Cadence says is the industry’s first complete tool for system thermal analysis, follows the launch of the Clarity 3D Solver earlier this year

A massively parallel matrix solver architecture delivers up to 10X faster performance than legacy solutions without sacrificing accuracy and  integrates with Cadence IC, package and PCB implementation platforms. This enables new system analysis and design insights to detect and mitigate thermal issues early in the design process.

Chip and system designs face increasing thermal challenges, particularly with 3D IC packaging, that can cause late-stage design modifications and iterations and derail project schedules. The Celsius Thermal Solver uses a multi-physics approach, combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids. It also suports analysis of static (steady-state) and dynamic (transient) electrical-thermal co-simulations based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behaviour.

This allows complete system analysis in the one tool. Combined with the Clarity 3D Solver, Voltus IC Power Integrity and Sigrity signal integrity tools  for PCB and IC packaging, designers can perform both electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation. 

The solver is built on matrix solver technology used for the Clarity 3D Solver and the Voltus IC Power Integrity tool and is optimised for cloud environments.

“As part of our Intelligent System Design strategy, Cadence is applying our extensive computational software expertise to new system innovations that address critical customer pain points,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “Following the highly successful launch of our Clarity 3D Solver earlier this year, the Celsius Thermal Solver helps our customers overcome the crucial challenge of system design and analysis of thermal effects and furthers Cadence’s expansion into new system domains.”

“In the automotive electronics industry, we depend on precise electro-thermal simulations to develop world-class automotive ASICs and system-in-package components,” said Goeran Jerke, senior project manager EDA Research and Advance Development, Automotive Electronics division at Robert Bosch. “The Celsius Thermal Solver is tightly integrated with the Virtuoso platform, which makes electro-thermal simulations easily and directly accessible to advanced circuit, layout and package designers. The Celsius Thermal Solver offers fast turnaround times and accurate results. We will be able to explore more design variants and to utilize electro-thermal simulation for new use cases that, until recently, were out of reach.”

“Advanced packaging techniques such as 3D-IC and face-to-face wafer bonding enhance the performance of electronic systems from mobile to high-performance computing applications, but bring new design challenges from the strong coupling between electrical and thermal effects,” said Vicki Mitchell, vice president of systems engineering, Central Engineering Group, Arm. “The addition of the Celsius Thermal Solver to Cadence’s system analysis portfolio allows our mutual customers to deliver next-generation electronic systems because we are now able to support thermal and electrical co-simulation in our design flows.”

The Celsius Thermal Solver is currently being used in production by select customers and is in general availability now.


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