Thermal paste boosts spot heat dissipation

New Products |
By Nick Flaherty

Delivering thermal conductivity of 5.5 W/m-K and heat capacity of 1 J/g-K, the TC50 paste is typically suitable for all bond lines over 0.15 mm thick. It provides low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. It only requires low compressive force to deform under assembly pressure. As a result, any stress on components, solder joints and leads is minimised. The compound can be packaged in syringes or cartridges, or bulk packaged.

Importantly, the heavy paste-like consistency of this one-component, RoHS compliant product can be easily dispensed in a controlled manner to produce different thicknesses in line with specific application requirements.

Chomerics –


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