Spring pressure contacts deliver better electrical properties for thyristor, diode and thyristor/diode modules

New Products |
By eeNews Europe

The new range includes a fundamental change to the design of the internal module structure. The modules now feature spring pressure contacts, meaning chips can now be freely positioned on the substrate and additional internal connections are no longer needed, improving reliability substantially. In addition, the heat management in the electronic packaging concept has been optimised, resulting in the elimination of materials and solder layers and a clear reduction in thermal resistance Rth. This means that the maximum continuous current of the SEMIPACK 1.6 is greater than in the previous-generation SEMIPACK 1.5. In thyristor modules the mean forward current was increased to 119A@TC=85°C, sin180° (+12%); in diode modules to as much as 134A@TC=85°C, sin 180° (+34%).

SEMIPACK 1.6 modules are mechanically interchangeable with the earlier SEMIPACK 1.5 units. The improved thermal distribution that results in part from the removal of solder layers has allowed a significant reduction in the copper baseplate area, reducing weight and cost.

The target applications for the modules are input rectifiers (single-phase, three-phase, non-controlled, semi-controlled or fully-controlled) for frequency inverters or UPS systems, lighting control systems in theatres and temperature control systems in furnaces.

Semikron has also introduced its new protective packaging concept SEMiSEAL in the SEMIPACK 1.6. The new packaging protects power modules by vacuum-sealing them between a plastic film and paperboard. The modules are automatically seal-packed once they reach the end of the production line and the final quality check has been completed. The modules are thus reliably protected from harmful environmental influences such as contamination and humidity. SEMiSEAL helps to ensure that modules are transported and stored safely, improving overall product quality.

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