The 1200 V MiniSKiiP PACK 2 and MiniSKiiP PACK 3 modules are available with the new Mitsubishi Electric’s latest gen 7 chips as well as standard Trench IGBT4 devices.
Designed for industrial and embedded drive applications, the modules reduce static losses by 20% and provide higher EMI performance with lower overall system costs. The extended power range of up to 200 A in te MiniSKiiP PACK 3 module makes it easier for engineers to develop flexible, scalable inverter designs.
The modules are available with various types of pre-applied thermal grease, and samples are available from distribution.
Please visit: www.vincotech.com/PACK-M7