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Rugged high-voltage gate drive ICs in a PQFN 4×4 package offers up to 85 percent smaller footprint

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By eeNews Europe

Featuring a footprint of just 16mm², the new PQFN4x4 (modified MLPQ 16-lead) package can accommodate many of IR’s high performance high-voltage gate drive ICs that previously required packages as large as the wide-body SOIC-16, offering up to a 85 percent smaller footprint. The new package has been designed with the appropriate creepage and clearance requirements to enable rugged and reliable designs at voltages up to 600 V.

Featuring a low profile of less than 1 mm, the PQFN 4×4 package is compatible with existing Surface Mount Techniques, is MSL2 rated and RoHS compliant.

International Rectifier’s HVIC technology integrates N-channel and P-channel LDMOS circuitry in an intelligent driver IC. The ICs receive a low-voltage input and provide gate drive and protection features for HV power-conditioning applications. Additionally, these monolithic HVICs provide integration of features and functionality to simplify circuit design and reduce overall cost, including the option to use a low-cost bootstrap power supply which eliminates the need for the large and expensive auxiliary power supply that discrete optocoupler or transformer-based designs typically require.

Pricing for the IRS2001M begins at $0.85 each in 10,000-unit quantities. Production quantities are available immediately.

Visit International Rectifier at www.irf.com.


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