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Quad-MOSFET solution boosts efficiency and eliminates heat sinking in active bridge applications

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By eeNews Europe

Excessive heat generation in high-definition, compact active bridge applications such as network cameras can cause image quality issues. Thermally induced noise can also affect the system’s image sensors which can also degrade the camera’s picture quality. The typical heat sinking solution to regulate thermal fluctuations can further complicate these intricate designs with added component count and cluttered board space.

Comprised of four 60 V N-Channel MOSFETs and utilizing Fairchild’s GreenBridge technology, the FDMQ86530L solution improves the conduction loss and efficiency of the conventional diode bridge providing a ten-fold improvement in power dissipation. Available in a thermally enhanced, space-saving 4.5 x 5.0 mm MLP 12-lead package, the device eliminates the need for a heat sink enabling a compact design that increases power conversion efficiency in 12 and 24 V AC applications.

Availability and Pricing

Samples are available upon request.  The FDMQ86530L product is available in a 4.5 x 5.0 mm MLP 12-lead package and is priced at $1.38

More information about the FDMQ86530L quad-MOSFET at www.fairchildsemi.com/cf/


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