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Paralleling of IGBTs and diodes of within a single power module helps push power capability

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By eeNews Europe

The Vincotech solution is able to use a 35 A sixpack module as a 100 A half bridge.  The use of sixpacks as half bridges can boost the performance and enable the use of preferred modules and packages at higher power levels.

Special care has to be taken regarding the drive circuit and current de-rating is to be considered when calculating the current of a single chip used in a multi-chip arrangement. Individual emitter sense down to chip level and symmetrical design are required of the power module. By using the components in parallel, not only can higher current levels be reached, but also the reliability of the design is improved.

Visit Vincotech at www.vincotech.com.


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