Microsemi introduces industry’s smallest hermetic surface mount package for transistors and diodes
The devices assembled as vehicles for this package qualification included medium power NPN and PNP bipolar transistors. Microsemi will also pursue qualifications for additional device types to support customer-specific requirements.
The compact U4 is 70 percent smaller than its U3 predecessor and available now exclusively from Microsemi. The package is constructed with aluminum nitride ceramic, which provides excellent heat dissipation. This is particularly important for small products such as power supplies, converters and regulators which operate at high current rates that can cause overheating issues.
The U4 has a typical power rating of 5W to 15 W (at TC=25°C) and is the smallest, hermetic surface mount package in its power category. Packaged parts are compatible with current pick-and-place assembly processes and are offered in tape-and-reel format.
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