Designed to address a rapidly growing market as the number of EV and PHEV vehicle designs and production volumes increase, the FAM65xxx APM16-packaged devices are offered as an integrated solution that eases design-in for automotive customers with one device outline covering H-Bridge, PFC, and bridge rectifier configurations to address applications at each OBC and DC-DC stage. The devices, says the company, can save approximately 50% board space and significantly ease manufacturability versus discrete component-based solutions.
The small size and weight of the modules, combined with high efficiency levels, can dramatically improve power density and system efficiency, contributing to reduced fuel consumption and CO2 emissions for vehicles, the company says. The new IPMs also offer improved reliability compared to discrete solutions and other power modules, due to optimized content and internal layout resulting in excellent thermal performance.
In addition, the IPMs offer lower electromagnetic interference (EMI) due to an integrated high-voltage capacitor. An internal direct bonded copper (DBC) structure that is fully isolated to 5 kV AC/second makes them easier to use by alleviating the need for insulation sheets associated with discrete solutions.
The devices feature compliance to the latest, most stringent automotive qualifications – AECQ 101 and AQG324. For more, see the Intelligent Power Modules page on the company’s site.