Encapsulated 80W AC-DC modules offer high power density

New Products |
By Graham Prophet

XP claims smallest footprint and highest power density available for an 80W encapsulated power supply module. The range is available in three formats for increased flexibility. The standard part comes as a PCB mount version, adding –S gives you a chassis mount version with screw terminals, and lastly the DIN rail version with screw terminals is available by adding –SD.


The ECE80 range is an extension of XP Power’s ECE series of small encapsulated AC-DC power supplies, offering power levels from 5 to 80W. They accommodate the need for smaller and more efficient power supplies with low no load power consumption. Additionally, the modules are suited to class II applications and offer Class B EMI without any additional filtering.


Peak load capability is up to 130% of nominal rated power output for 30 seconds, to power short term higher power loads, so designers may not need to specify a higher rated and possible physically larger power supply.


With a power density of over 11.2 W/in³ the modules take up less space in products. The ECE80 PCB mount module measures 91.4 x 45.72 x 28.0 mm and the chassis mount module measures 113.0 x 47.5 x 28.5 mm. Five standard output voltages are available from 12 to 48 VDC. The modules’ no-load power consumption is under 0.3W and efficiency is up to 89%; class II construction means that no ground (earth) connection required.


With their wide operating temperature range of -40 to +70C (with no derating until +50C), XP Power’s ECE80 modules are able to operate in most environments with no need for additional heat sinking or airflow. The modules meet Class B conducted and radiated EMC limits without any additional components, and are UL/CSA/EN/IEC 60950-1 safety agency approved.


XP Power;



Linked Articles
eeNews Power