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AMD extends APU range for fanless systems

Technology News |
By eeNews Europe

The company claims this is an unprecedented low-power offering for the embedded market that features one or two low-power x86 “Bobcat” CPU cores and a discreet class DirectX 11-capable GPU on a single die. 

“We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement,” said Buddy Broeker, director, Embedded Solutions, AMD.

A fanless solution is often preferred for noise or cost reasons, or for embedded products that are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system.

Systems already based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.


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