1200V IGBT power module boost for solar inverters

1200V IGBT power module boost for solar inverters
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Infineon Technologies has launched a 1200V, 900A medium power module using its TRENCHSTOP IGBT7 in standard EconoDUAL 3 industry package for solar inverters and indistrial drives.
By Nick Flaherty


Infineon Technologies has launched a medium power module using its TRENCHSTOP IGBT7 in standard EconoDUAL 3 industry package.

The IGBT7 technology gives the 1200 V power module a nominal current of 900 A, enabling a 30 percent higher inverter output current for the same frame size compared with the former technology. While specific improvements of the module’s chip and housing directly aim at industrial drive applications, it can also be very well implemented in designs for commercial, construction and agricultural vehicles (CAV), servo drives, as well as solar and UPS inverters.

Using micro-pattern trench technology, the TRENCHSTOP IGBT7 chip exhibits lower static losses compared to the IGBT4, with the on-state voltage 30 percent lower for the same chip area. This brings significant loss reduction in the application, especially for industrial drives, which usually operate at moderate switching frequencies. Additionally, the oscillation behaviour and the controllability of the IGBT have been improved. The power modules feature a maximum allowed overload junction temperature of 175°C.

Another improvement concerns the freewheeling diode (FWD) which has also been optimized for drive applications. The forward-voltage drop of the emitter-controlled 7th generation diode (EC7) is now 100 mV lower than the forward-voltage drop of the EC4 diode, with reduced oscillation tendency during diode turn-off.

The higher power density of the EconoDUAL 3 helps to avoid paralleling of modules, which leads to a simplification of the inverter design and lower costs. Moreover, the new technology can be implemented in the same footprint facilitating the upgrade of existing inverter system designs. The EconoDUAL 3 module comes with an improved housing for handling higher currents and temperatures. It is available with pre-applied thermal interface material (TIM) for lowest thermal resistance and longest lifetime. The PressFIT housing enables a fast and cost-efficient assembly.

The 900 A module is the first from Infineon’s EconoDUAL 3 portfolio, and other module types and current classes will follow in 2020. The lead type FF900R12ME7_B11 can be ordered now. The FF900R12ME7P_B11 with pre-applied TIM will be available by January 2020.

www.infineon.com/econodual3 and www.infineon.com/igbt7.

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