There is little doubt that the automotive industry is going through an electronics revolution. With this impending growth, there are several opportunities for stakeholders to increase their revenues while adding functional and economic value to end users. Whether its autonomous driving, infotainment systems or electrification applications in a car, performance, reliability and cost aspects shape each player’s differentiation strategy. As a result, there is tremendous innovation from both integrated device manufacturers (IDM) and outsourced assembly and test (OSAT) suppliers. This paper will provide a brief overview on value creation in the electrification segment, specifically for power semiconductor packaging.