The flow90PACK 0 and flow90PACK 1 are rated for up to 75 A and up to 1200 V and the flow90 housings eliminate the need for L-shaped heat sinks, cutting costs by half. The pins on these modules are arrayed at a 90-degree angle, so there is no need for a flexible PCB and a layout with this angle between the heat sink and PCB reduces the footprint by as much as 40%.
Optional clip-in versions are available for even easier assembly as they slot right into the PCB on the same side as other through-hole components.
This housing comes in two sizes—flow90PACK 1 measuring 35 x 84 x 21 mm and the new 38 x 66 x 21 mm flow90PACK 0.
Sample modules are available now.
Viincotech is a key part of Mitsubishi Electric's power device strategy.