Encapsulated digital power modules supply up to 70A

October 10, 2018 // By Nick Flaherty
Renesas Electronics has launched a family of encapsulated digital DC/DC PMBus power modules with outputs from 25A to 70A.

The five RAA210xxx simple digital power modules offer advanced digital telemetry and performance, and are as easy to use as Renesas’ analogue power modules. They are complete step-down regulated power supplies that deliver 25A, 33A, dual 25A, 50A, and 70A of output current, while operating from industry-standard 12V or 5V input power rails.

The family provides point-of-load (POL) conversion for advanced FPGAs, DSPs, ASICs and memory used in servers, storage, optical networking, and telecom equipment. Each device integrates a PWM controller, MOSFETs, inductor and passives inside a thermally optimized, High Density Array (HDA) encapsulated module. All that is needed to complete the power supply are input and output bulk capacitors.

The RAA210xxx is a lower cost, simplified digital power module family that is pin-to-pin compatible with Renesas’ full featured digital ISL827xM series. The RAA210xxx simple digital power modules offer run-time digital programmability to support configuration changes with a subset of PMBus commands, and full telemetry and system monitoring. If more advanced digital control is later required, upgrading to the pin-compatible ISL827xM modules will enable current sharing with multiple modules connected in parallel, access to all PMBus commands using the PowerNavigator™ tool, and non-volatile memory for configuration storage.

“Our simple digital power modules accelerate time to market for design teams that want an easier-to-use, lower-cost digital power solution,” said Philip Chesley, Vice President of Industrial Analog and Power Business Division at Renesas. “The RAA210xxx simple digital power products continue Renesas’ leadership in power density, high efficiency and fast transient performance to support demanding multi-rail POL requirements.”

The proprietary HDA package offers higher electrical and thermal performance at full load through a single-layer conductive package substrate that efficiently transfers heat from the module to the system board, and dissipates it without requiring airflow or heatsinks. Space-constrained boards take full advantage of the HDA’s high power density, which Renesas says is not achievable with discrete components.

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