The SPM 1004, SPM 1005 and SPM 1006 non-isolated Point-of-Load modules with PSI² technology are able to use the maximum amount of magnetic material for their package size; the coil can use thicker wire for lower resistive losses and higher efficiency. The SPM series now extends from 3.3V to 36V input and from 0.6V to 18V output, with maximum load capability up to 12A. The magnetic material is thermally conductive avoiding hot spots and improving reliability. The measured surface temperature is reduced by 11.5°C compared to a power module with an internal inductor under identical conditions. Electromagnetic shielding for the switching components reduces radiated EMI (Electromagnetic Interference). Over the entire load range, the circuit topology allows less than 20 mV transient under a 3A load step.
These integrated power modules are fully tested and can simplify the end product design. They are qualified to IPC9592B standard, Class II. Small size and very low profile (3 mm) packages reduce board space and allow higher density applications up to 1600W/cu in. All major components are internal to the module. Fields of application are broadband and communications equipment, DSP and FPGA Point of Load applications, high density distributed power systems, products based on PCI/PCI express/PXI express and automated test and medical equipment.